MVT 2486-BSS

System Features/Specifications

• Dimensions — Nominal 28” (711.2mm) O.D. x 10.5” (266.7mm) High 304 Grade Stainless-Steel, electro-polished/passivated. A rectangular flanged port on the left side of the chamber will be included for attaching the optional load lock.
• Shutters — A shutter is provided to pre-clean the targets prior to sputtering and also to prevent contamination of the target(s) during RF Sputter Etch and Sputter Deposition
• Shielding — Easily removable for maintenance; Stainless-Steel shielding facilitates chamber cleanliness
• View Port — 6” O.D. Conflat Flange with nominal 5” (127mm) Pyrex Glass Viewing Area
• Flanges — Two (2) Each QF50 Flanges, 6” Conflat Flange for View Port, Load Lock Option Flange, Optional 6” Conflat Flange at Rear
• Annular Substrate Table — Nominal 21” (533.4mm) Diameter Water-Cooled Rotating Substrate with RF Sputter Etch/Bias capability. Features multi-pass deposition with full rotation or 90° indexing for static deposition for maximum process flexibility. Target to substrate distance is variable.
• Substrate Holder — A convenient to use aluminum pallet designed to hold the customer’s substrate(s) during deposition. Gravity held onto the substrate table.

• Nominal 28” (711.2mm) O.D. x 1” (25.4mm) Thick 304 Grade Stainless-Steel, electro-polished/passivated

• Nominal 28” (711.2mm) O.D. x 1” (25.4mm) Thick 304 Grade Stainless-Steel, electro-polished/passivated with 7.75” (200mm) pump-out port

• Heavy Duty Electric Hoist or Hydro-pneumatically-Controlled Hoist Cylinder Assembly permits easy opening (closing) of the sputtering chamber by raising (lowering) the top plate.

• MATERIALS RESEARCH CORP. STYLE:
  • 8.0” Diameter MRC Style RF/DC Magnetron
  • 8.0” Diameter MRC Style RF Diode (Type A or B Backing Plate)
  • 6.5” Diameter MRC Style RF/DC Magnetron
  • 6.0” Diameter MRC Style RF Diode
  
  
• PERKIN-ELMER STYLE:
  • 8.0” Diameter P-E Style DC Magnetron
  • 8.0” Diameter P-E Style RF Magnetron
  • 8.0” Diameter P-E Style RF Diode
  • 6.0” Diameter P-E Style RF Diode
  
  
• LEYBOLD-HERAEUS PK150 STYLE:
  • 6.0” Diameter L-H Style RF/DC Magnetron
  • 6.0” Diameter L-H Style Diode
  
  
• ETERNA SELF-SPUTTERING SOURCES:
  • 100mm Diameter Eterna RF/DC Magnetron
  • 50mm Diameter Eterna RF/DC Magnetron
  
  
• SPECIAL REQUEST STYLE(S):
  • 8.0” Diameter CVC, On-Request/Special Order

• ENI Model OEM25 2.5KW Solid State Power Supply

• RF VII / MAT-VAC Solid State Design

• Advanced Energy MDX-5 - 5kW DC Magnetron Solid State Power Supply

• Roughing Pump/Mechanical Pump — 17 CFM Welch Model 1397 Stand or Optional - 27 CFM Two (2) Stage Direct Drive Mechanical Pump
• High Vacuum Pumping — Helix/CTI Cryogenics CTI-8 Cryo-pump and CTI Compressor (customer choice of water-cooled or air-cooled)
• Valving — 6” (152.4mm) ASA Stainless-Steel Electro-Pneumatic Gate Valve, Stainless-Steel Electro-Pneumatic Fore-Line (with turbo pump option) and Roughing Valves with QF 40 Flanges.
• Throttle Valve — Electro-pneumatically activated with adjustable stop for closed position.

• Control System — GE-Fanuc Modular 90-30 Series Industrial Quality PLC mounting in seperate "roll around" 19" electronic control rack
• Sputtering Gas Pressure Measurement/Control System — MKS Upstream Flow Control Consisting Of: MKS MFC with MKS 250/247 Power Supply/Display and MKS Baratron (Uses Standard Venetian Blind Throttle Valve)
• Gauging — Granville Phillips Model 307 Ionization/Convectron Gauge Controller

• 30” (762mm) Deep x 54” (1371.6mm) Wide x 75.81” (1925.6mm) Tall heavy duty powder coated steel frame and panels with casters/wheels (Note: If additional mounting capacity is required for electronics, a separate 19” (482.6mm) rack mount cabinet is provided)

• Water flow switches protect the targets and substrate table in the event of inadequate water flow. A vacuum switch prevents the application of sputtering power with the chamber at atmosphere. Panel interlock switches prevent the presence of dangerous voltages and operation of the sputtering system when equipment covers are removed for system maintenance.

• Water — 40 to 60 psi, 5 gpm Flow Rate
• Sputter Gas — Argon, Ultra High Purity Grade
• Purge Gas — Nitrogen process quality
• Compressed Air — >80 psi for valve operation (MAT-VAC System is configured with an internal air pressure regulator. Note: Customer must provide air dryer/filter to ensure clean dry air)
• Electrical — 208 Vac, 50/60 Hertz, Three (3) Phase, Y (Other AC Voltages can be accommodated through the use of an external AC step-down transformer)
• Amperage — 40 to 100 Amps. Service depending on system configuration

• Load Lock — The optional manual load lock is designed specifically for transfer of substrate to/from the sputtering chamber while keeping the targets and sputtering chamber at high vacuum, greatly minimizing oxidation, contamination and increased throughput. Load Lock is Rough Vacuum Pumped by the Mechanical Pump.
• Optional Sputtering Gas Pressure Measurement/Control System: — MKS Downstream Pressure Control consisting of: MKS 651 Controller, MKS 653B Throttle Valve and MKS 627 Baratron with MKS 1179 MFC and MKS 247D Power Supply/Display.
• High Vacuum Pumping — Varian V551 Navigator Turbo Molecular Pump/Controller High Vacuum Pump in place of Helix/CTI Cryo-Pump
• Heater Accessory — 400°C Radiant I.R. Quartz Heat Lamps flange mounted on the top plate at the 4th target position with PID Controller
• Co-Sputtering — Available upon customer request, contact factory.
• Additional Chamber Flange — 6” Conflat Flange at Rear of Process Chamber, 180° from front view port (Additional optional flanges are available, per customer requirement)
• Direct Drive Mechanical Pump — 27 CFM Two(2) Stage Direct Drive Mechanical Pump in place of standard 17.7 CFM Indirect Drive Mechanical pump.