MVT-90X Series Sputtering System Specifications

• MAT-VAC EXCLUSIVE ADVANCED FEATURES:
  
  
• GUI BASED PLC OPERATING SYSTEM with RASP:
  1. MAT-VAC's innovative state-of-the-art Universal Sputterer PLC GUI design combined with Remote Access Support Program (RASP) allows MAT-VAC the capability to download software updates, revisions, fixes and diagnose software/hardware problems over a secure, virus protected, high speed internet connection from its Florida, USA based headquarters location or any other location. Learn more.
  2. Comprehensive online/interactive/multimedia system documentation for all hardware and software and one printed hard copy.
  3. Dell™ PC with Dell™ LCD Monitor with optional 17" touch screen available.
  
  
• SEPARATE DETACHABLE 19" RACK MOUNT ELECTRONIC CONTROLS:
  
  
• SYSTEM REDESIGN AND SPUTTERING CAPABILITIES:
  1. Up to four (4) Targets Lid Mounted configured for sputter down operation.
     
     1. The MVT-90X/4 is a four (4) target sputtering system
        
     2. The MVT-90X/3 is a three (3) target sputtering system
     3. The MVT-90X/2 is a two (2) target sputtering system
  2. DC Magnetron, RF Magnetron and RF Diode sputtering Capabilities.
  3. 24 Volts DC components designed throughout each MAT-VAC batch sputtering system with EMO circuitry.
  4. Advanced optical position feedback on carrier position
  5. Each MAT-VAC Model MVT-90X Series Load Lock In Line Batch Sputtering System includes:
     1. New MAT-VAC designed modular electro-pneumatic valve bank.
     2. New Hydraulic Pump/Motor and all lines
     3. Hydraulic block assembly with new valving
     4. Electro-pneumatic gate valve for process chamber
  6. High quality O-ring seals, bearings, fasteners, water lines, gas lines, air lines, and wiring are utilized throughout.
  7. Main Chassis frame is professionally powder coated with a very durable and scratch resistant finish.
  8. Proteus interlock water flow switches
  9. New MAT-VAC designed electronic circuitry, electrical wiring & power distribution box/circuit breakers - No FUSES to stock!
  
  
• VACUUM SYSTEM:
  1. Dual Level Load Lock Elevator for Loading/Unloading of substrate pallets to/from process chamber. Venting, unloading, reloading and pump down all occur while the substrates in the process chamber are being coated. This innovative Dual Level Load Lock Elevator design combined with the nominal 12" x 12" substrate pallet/holder offers very favorable Substrate Loading Factors for various size wafer diameters, rectangular hybrid ceramic substrates, display panels, and Photovoltaic Solar panels with excellent film uniformity and high throughput operation.
  2. Load Lock Chamber is rough vacuum pumped, hinged at rear via 'clam shell' type Load Lock Dome.
  3. Pallet Carrier holds 12¼" X 12¼" (310 mm X 310 mm) substrate pallet.
  4. Up to six (6) Pyrex viewport with viewport shutter actuated by ferrofluidic type rotary feedthrough.
  5. CTI-8 cryo pump on main process chamber with Oxford Instruments E350 digital temperature readout gauge. Cold Head pressure is also shown via digital dual set point indicator.
  6. CTI Air cooled cryo compressor (Water cooled compressor optional.)
  7. Software includes AutoRegen feature for unattended Cryo Regeneration.
  8. 27 CFM direct drive mechanical roughing pump.
  9. Easily removable stainless steel chamber shielding and anode plane.
  
  
• VACUUM GAUGING:
  1. Digital Vacuum Gauge / Controls (Granville-Phillips / Digivac)
  
  
• SPUTTERING GAS INSTRUMENTATION:
  1. MKS automatic gas control system with up to four (4) each (one is standard) MKS mass flow controllers, MKS 250, MKS 247 and MKS Baratron Gauge.
  2. Electro-Pneumatic throttle valve with Bimba Pneumatic Actuator
  
  
• SPUTTERING CATHODE OPTIONS:
  1. Choice of nominal 5" x 15" MRC-type Cathode Assemblies:
     • RF Diode Planar
     • RF/DC Planar Magnetron
     • RF Planar Magnetron, Model II
     • DC Magnetron (MRC-type) clamp on target design
  
  
• POWER SUPPLY OPTIONS:
  1. Advanced Energy model 5kW or 10kW Solid State DC Magnetron sputtering Supply options.
  2. Advanced Energy model 1250 or 3000 Watt Solid State RF (13.56 MHz) Sputtering/Etching power supply options.
     RF Sputtering comes standard with advanced RF Autotune network for optimum coating efficiency
  
  
• MAJOR OPTIONS:
  1. RF Sputter Etch Platform (optional) of stainless steel, water-cooled, with dual pneumatic cylinder actuation and linear bellows-sealed feedthrough, rises to lift pallet off pallet carrier for etching.
  2. Infra-Red quartz heater assembly with Watlow heater control mounted above the (optional) RF Etch platform at right end of chamber/lid.
  3. RF Autotune RF matching network engineered by MAT-VAC. The problematic MRC designed target selector switch has been completely eliminated.
  
  
• NOMINAL PHYSICAL DIMENSIONS:
  1. Main Chassis: (Excluding Separate 24" W x 30" D x 84" H (nominal) Universal Sputterer™ Control Rack common to all models.)
     
     

     Model	MVT-90X/2		MVT-90X/3		MVT-90X/4
     Unit	US	Metric	US	Metric	US	Metric
     Length	67"	1.7 m	79"	2 m	91"	2.3 m
     Depth	36"	.9 m	36"	.9 m	36"	.9 m
     Height	59"	1.5 m	59"	1.5 m	59"	1.5 m
     Weight*	2650 lb	1200 kg	3000 lb	1365 kg	3500 lb	1600 kg
     * Approximate, Depends on Configuration

     
     
  2. Vacuum Chamber:
     Rectangular, heliarc welded 5/8 (16mm) Stainless Steel Plate
  3. Process Chamber Internal Dimensions:
     6-7/8" (175 mm) Deep, 23" (584 mm) Wide, 69½" (1765 mm) Long
  
  
• AC POWER INPUT REQUIREMENTS:
  1. 208 Volts, 100 Amps, 60 Hz, Y
     Note: Customer can utilize an external 45 KVA step-down or step-up transformer to accommodate other AC power input voltages. 50 Hz compatibility is available upon request (requires frequency converter for cryo pump compressor and 50 Hz motor on mechanical pump and hydraulic pump.)