Thin Film Sputter Coating Services
Introduction
MAT-VAC holds an expertise in thin film sputter coating technology. Our highly
knowledgeable thin film process engineers and technicians utilize modern, state-of-the-art MAT-VAC In Line Load Lock Batch Sputtering PVD deposition equipment with large area substrate loading capabilities as well as cylindrical/round sputter chambers and the latest analytical techniques to produce high quality thin films that meet your most
demanding deposition requirements.
Capabilities
MAT-VAC's 3 and 4 target Load Lock Sputtering Systems permit the processing of multiple thin film layers in one in situ process step in vacuo without breaking vacuum. This results in superior adhesion between layers. RF Diode, RF Magnetron, DC Magnetron, and Pulsed DC Magnetron sputtering modes are utilized to produce thin films that are highly uniform, dense, homogeneous, and stoichiometric. Our large area substrate loading capabilities allows us to process any wafer or panel size up to 300mm or 12in2 with a ±5% thickness uniformity. Our metal film deposition service includes single layer and multy-layer combinations of pure metals/metal alloys and dielectrics. Typical sputtered microelectronic thin film coatings include, but are not limited to, the followings metallization schemes:
- Al/Al alloys
- Cr-Cu-Au
- Ti-Pd-Au
- Ti-Pt-Au
- Ti/W-Ni-Au
See our Sputtered Metals and Applications Chart below. Custom thin film metallizations are available for a wide variety of deposition and hybrid circuit fabrication requirements. Electroplating and substrate patterning of thin films are not currently available.
Sputtered Metals and Applications
| Application |
Material |
Typical Values |
| Adhesion Layer(s) |
Titamium-Tungsten (TiW)
Chromium (Cr) |
250-750 Angstroms
250-750 Angstroms |
| Barrier Layer(s) |
Nickel (Ni) - Sputtered |
750 - 2000 Angstroms |
| Conductor Layer(s) |
Cupper (Cu)
Gold (Au) |
30 - 300 µin.
10 - 200 µin.(0.25 - 5 µm) |
| Resistor Devices |
Tantalum-Nitrade (TaN)
Nickel-Chromium (NiCr)
Chromium-Silicon (CrSi) |
10 - 150Ω (Min)
20 - 350Ω (Max)
500 - 1500Ω |
Wide Assortment of Target Materials
MAT-VAC has an extensive inventory of almost any target material imaginable, including many standard high purity materials, exotic alloy materials, precious metals and
ceramic dielectric sputtering targets, which are available in a wide range of different sizes and shapes.
Medical Implant Devices
MAT-VAC's thin film coatings are currently being utilized in commercial, FDA approved medical cardiac implant electrode applications.
Flexible Substrates
MAT-VAC has a great deal of expertise in sputter coating flexible substrates such as Polyimide (Kapton)
and PET Polyester (Mylar) with single and multi-layer thin film coatings. Flexible thin film applications are currently of high interest, due to the need for flexible circuits, flexible heaters, thermo-couples, solar panels, touch screens, displays, optical devices, product anti-tampering, food packaging, ... etc. which offer product design advantages of lightness, miniaturization, compactness, weight reduction and the ability to flex in a variety of ways.
MAT-VAC has developed proprietary processes, which promote excellent adhesion and maximum flexibility. Materials such as ITO, various metals, and oxides have been successfully achieved in this manner.
Co-Sputtering Capability
MAT-VAC has developed a unique co-sputtering capability which allows us to deposit simultaneously from two (2) sputtering sources/targets. This capability can be utilized to form alloys and blended materials in a wide range of compositions.
Hybrid/Resistive Thin Films
A wide range of thin films can be deposited onto Silicon, GaAs and ceramic substrates. These films are sputtered under carefully controlled
conditions producing excellent resistive and TCR (temperature coefficient of resistance) results.
Magnetic Thin Films
Co-Ni, Co-Cr, and Ni-Fe alloy films for magnetic media and recording heads can be deposited.
Oxides
Reactively sputtered oxide films can be deposited onto a variety of substrates.
Growth conditions, such as substrate temperature and gas pressures, are carefully
controlled, providing superior film structure and properties. Thin films of the
transparent conductor - Indium Tin Oxide (ITO) for flat panel display and liquid
crystal device developments can also be produced.
Nitrides
A reactive sputtering process can deposit silicon and titanium nitride films with excellent
electrical, mechanical, and optical properties. Titanium Nitride (TiN) films are becoming more widely used
as passivation layers for VLSI, decorative gold coatings, and wear coatings.
For MAT-VAC to consider your thin film requirement submit here.
For our Thin Film Thickness Conversion Table, click here.
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