Target Bonding

Target bonding which consists of the application of proprietary Thin Film coatings and specialty indium based solders to the customer supplied or MAT-VAC′s newly remanufactured backing plate(s) / sputtering target mating surfaces is one of our core specialties. When a backing plate is to be supplied by the customer, the backing plate is rigorously inspected to insure its serviceability. We will inform you, upon receipt of your backing plate if repair or replacement is required. When inquiring, please let us know if target bonding will be required for your target and the type of backing plate that you will be utilizing.

Please also notify us if a spent target will be sent attached to the backing plate.

Spent targets are not returned unless otherwise specified in writing in the purchase order.

All bonds are guaranteed 100%. Extensive measures are taken to insure all bonds will withstand the rigors of the sputtering process. We incorporate vacuum bonding technology, coupled with X-Ray and ultrasonic testing techniques.

Silver Epoxy target bonding is also available. Please contact us for more details.