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MAT-VAC Technology June 2010 Newsletter
Better Film Quality — Lower Acquisition & Life Cycle Costs — PVD Thin Film Applications

MAT-VAC TECHNOLOGY NEWSLETTER June 2010

Message from MAT-VAC President


Joseph "Joe" Michaud
Welcome to the June 2010 issue of our company newsletter.

This issue spotlights our modernized Universal Sputterer tm 94X Series in line load lock sputtering system products.

These newly redesigned sputtering systems are state of the art with highly advanced hardware, automation software and PVD processing capabilities which were not available on the original MRC 900/600 series designs.

On behalf of the management and dedicated employees of MAT-VAC Technology, Inc., we would welcome the opportunity to work with you on any existing and/or future PVD in line sputtering system requirements.

Thank you.

Joseph "Joe" L. Michaud



MVT-94X Series Sputtering System

Evolved from the popular MRC 942 and MRC 943, the MAT-VAC 94X Series Universal Sputterer™ automated in line batch sputtering systems feature a high vacuum pumped dual level load lock with a dedicated CTI-8 cryo pump, horizontal "Sputter Down" mode of sputtering in two, three or four target positions, DC magnetron, RF magnetron and RF diode sputtering mode capabilities at each target position, an RF etch platform which can also function for substrate cooling. Pre-heating of substrates via a quartz radiant heater array is available in the load lock chamber to aid in the removal of substrate water vapor and volatile contaminants.

MAT-VAC also has the capability to utilize KDF pre i series in line sputtering systems ("T ", "GT", and "NT" models) in its Universal Sputterer tm 9X/6X Series modernization manufacturing process.

The unique design of the dual level load lock functions to permit the simultaneous processing of two nominal 12" X 12" pallets (one pallet can be undergoing process in the main process chamber, while a second pallet is being pumped down in the load lock).


Model MVT-94X/2 MVT-94X/3
Unit US Metric US Metric
Length
67"
1.7 m
79"
2 m
Depth
36"
.9 m
36"
.9 m
Height
87"
2.2 m
87"
2.2 m
Weight*
3000 lb
1365 kg
3500 lb
1600 kg
* Approximate, Depends on Configuration


Specifications:
  • MVT-94X Series Specifications
  • 9X Series Installation/Utility Specs

    Features:
  • Advanced Features
  • PLC / GUI Automation System
  • RASP Software
  • Sputter Run Log Plotter™
  • Substrate Loading Capabilities

    Documentation:
  • Universal Sputterer™ Presentation
  • Single, and bi-directional substrate scanning modes are featured for the utmost process control under the control of a new state of the art motor/speed control system and optical encoder for precise positioning.

    Cathodes choices available to cover every conceivable sputtering application consist of MRC type DC magnetron w/ clamp on target designs, RF/DC planar magnetron, RF magnetron Model II and RF diode.

    A modern RF automatic matching network provides excellent, stable RF tuning capabilities for RF sputtering and RF etching. Advanced Energy solid state RF power supplies are available in 1250 and 3000 watts. The MAT-VAC design employs vacuum relays to switch between RF and DC modes and cathode selection.

    Advanced Energy solid state power supplies are available in 5 and 10 KW models for DC magnetron sputtering.

    Up to 4 sputtering gas channels are available with modern MKS Instrumentation.

    MKS automated gas control system with up to 4 Mass Flow Controllers (MFCs).

    Vacuum gauging controls consists of modern digital Granville Philips 307 and Digivac.

    A CTI-8 cryo pump is provided for high vacuum pumping of the process chamber and a 27 cfm two stage direct drive mechanical pump provides for rough vacuum.

    Regeneration of both load lock and process chamber cryo pumps are performed automatically.

    In addition to all of the above MAT-VAC 94X series standard features, MAT-VAC has incorporated numerous Advanced Features that make the MAT-VAC 94X one of the most technologically advanced load lock batch sputtering systems on today's market.

    »» More Information

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